The 1/4-inch OV8850 leads the CMOS sensor pixel design race in the smartphone market by enabling autofocus modules that are 20 percent slimmer than today’s 1/3.2-inch 8-megapixel modules. Besides a small footprint, the 1.1-micron OmniBSI-2 pixel offers significant improvements in power efficiency and comparable image quality to the previous generation 1.4-micron OmniBSI™ pixel, making it an attractive solution for next-generation smartphones and tablets.
An integrated scaler allows the camera to maintain full field of view in 1080p/30 high-definition (HD) video and preview modes and provides extra adjustable resolution for electronic image stabilization (EIS). Additionally, the sensor’s 2 x 2 binning functionality provides EIS for 720p/60 HD video recording. Other advanced features of the OV8850 include an on-chip temperature sensor, two PLLs, context switching, 4 Kbits of one-time programmable memory, lens shading correction, defective pixel cancelling, black sun elimination, and alternate row exposure for high dynamic range (HDR) video and still image capture.
The OV8850 supports 8 and 10-bit RAW image output with all standard image quality control functions supported through the SCCB interface. The sensor fits in an 8.5 x 8.5 mm autofocus camera module with a build height of 4.7 mm and features a 4-lane MIPI/LVDS that facilitates the required high data transfer rate.
|Package Size||5550 x 5400 µm|
|Array Size||3280 x 2464 µm|
|Pixel Size||1.1 µm|
|Frame Rate||30 @ EIS1080p
24 @ Full
60 @ EIS720p
|Temperature||Stable: 0° – 65°C
Operating: -30° – 70°C
|Product Brief||Product Brief|